The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2008
Filed:
Mar. 23, 2005
Hiroshi Miyakoshi, Hachioji, JP;
Kazumi Furuta, Akishima, JP;
Masahiro Morikawa, Hachioji, JP;
Osamu Masuda, Machida, JP;
Makiko Imae, Hino, JP;
Hiroshi Miyakoshi, Hachioji, JP;
Kazumi Furuta, Akishima, JP;
Masahiro Morikawa, Hachioji, JP;
Osamu Masuda, Machida, JP;
Makiko Imae, Hino, JP;
Abstract
There is described a molding method for molding a product, having a microscopic structure of high aspect ratio. The molding method includes the steps of: setting a temperature of a mold, having a microscopic shape, at a value higher than a glass transition temperature of a material being deformable with heat; pushing the mold against the material at a first velocity, after the material is positioned opposite to the mold so that the microscopic shape contacts the material; pushing the mold against the material at a second velocity being faster than the first velocity; and releasing the mold from the material. The pushing pressure for pushing the mold against the material at the first velocity is equal to or smaller than a half of that for pushing the mold against the material at the second velocity.