The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2008
Filed:
Jun. 15, 2006
Seung Gu Kim, Chungcheongbuk-do, KR;
Chang Sup Ryu, Daejeon, KR;
Han Seo Cho, Daejeon, KR;
Doo Hwan Lee, Gyeonggi-do, KR;
Hwa Sun Park, Seoul, KR;
Seung Gu Kim, Chungcheongbuk-do, KR;
Chang Sup Ryu, Daejeon, KR;
Han Seo Cho, Daejeon, KR;
Doo Hwan Lee, Gyeonggi-do, KR;
Hwa Sun Park, Seoul, KR;
Samsung Electro-Mechanics Co., Ltd, Kyunggi-Do, KR;
Abstract
Disclosed is a method for manufacturing a circuit board, comprising step for preparing an insulating member and an electronic component having position-setting means on the lower surface thereof (S), step for forming mounting holes in the insulating member (S), step for mounting the electronic component on the insulating member to meet the position-setting means and the mounting holes (S), step for forming copper cladding coated with an adhesive on the insulating member (S), step for applying heat and/or pressure to the copper cladding (S), and step for forming a via-hole in the copper cladding to be electrically connected to the electronic component, and step for forming a circuit pattern in the copper cladding (S). The step (S) can comprise a step (S) for applying inter-adhesive on respective surfaces of the insulating member, and a step (S) for applying copper cladding on respective surfaces of the inter-adhesive.