The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2008
Filed:
Sep. 13, 2004
Jerimy Nelson, Fort Collins, CO (US);
Mark D. Frank, Longmont, CO (US);
Peter Shaw Moldauer, Wellington, CO (US);
Karl Bois, Fort Collins, CO (US);
Jerimy Nelson, Fort Collins, CO (US);
Mark D. Frank, Longmont, CO (US);
Peter Shaw Moldauer, Wellington, CO (US);
Karl Bois, Fort Collins, CO (US);
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Abstract
A method for routing vias in a multilayer substrate is disclosed. One embodiment of a method may comprise providing a multilayer substrate with an internal bond surface having a plurality of internal bond pads and an external bond surface with a plurality of external bond pads. A plurality of power vias and ground vias may be routed from a first redistribution layer between the internal bond surface and the external bond surface to a second redistribution layer between the first redistribution layer and the external bond surface based on a via pattern. The via pattern may comprise routing a power via and a ground via adjacent one another spaced apart at a distance that is substantially equal to a minimum routing pitch associated with the multilayer substrate.