The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7327554 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 05, 2008

Filed:

Mar. 17, 2004
Applicants:

Jun Otsuka, Aichi, JP;

Manabu Sato, Nagoya, JP;

Junichi Ito, Mie, JP;

Kazuhiro Hayashi, Aichi, JP;

Motohiko Sato, Aichi, JP;

Inventors:

Jun Otsuka, Aichi, JP;

Manabu Sato, Nagoya, JP;

Junichi Ito, Mie, JP;

Kazuhiro Hayashi, Aichi, JP;

Motohiko Sato, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/228 (2006.01);
U.S. Cl.
CPC ...
Abstract

An assembly includes a semiconductor device having surface-connecting terminals, a substrate having surface-connecting pads, and a capacitor having an approximately plate-shaped capacitor main body having a first surface on which the semiconductor device is mounted and a second surface at which the capacitor main body is mounted on the substrate and a plurality of electrically conductive vias penetrating the capacitor main body between the first and second surfaces and connected to the surface-connecting terminals and the surface-connecting pads.


Find Patent Forward Citations

Otsuka, Jun. (2008). Assembly of semiconductor device, interposer and substrate (U.S. Patent No. 7327554). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7327554

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