The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2008
Filed:
Aug. 04, 2005
Nobuyuki Naka, Kyoto, JP;
Akihiro Katanishi, Kyoto, JP;
Masaaki Magari, Kyoto, JP;
Yoshiyuki Nakajima, Kyoto, JP;
Kimihiko Arimoto, Kyoto, JP;
Nobuyuki Naka, Kyoto, JP;
Akihiro Katanishi, Kyoto, JP;
Masaaki Magari, Kyoto, JP;
Yoshiyuki Nakajima, Kyoto, JP;
Kimihiko Arimoto, Kyoto, JP;
Horiba, Ltd., Kyoto, JP;
Abstract
The present invention provides a method and substrate examining device that sequentially and automatically measures at least the thickness and the internal stress of the thin film at a predetermined measurement point on the surface of every manufactured semiconductor substrate to perform quality control on each substrate, and reliably recognizes the cause of defects to improve productivity. The examining device and method accurately analyzes the correlation between film thickness and stress to establish the manufacturing processes necessary for manufacturing a semiconductor substrate of higher performance, and measures the distribution of a physical quantity such as internal stress, index of refraction, and composition of the semiconductor substrate in the film thickness direction, without being influenced by change in ambient environmental temperature thereby further improving examination precision.