The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2008

Filed:

May. 28, 2002
Applicants:

Yoshihisa Dotta, Nara, JP;

Kazuo Tamaki, Kyoto, JP;

Inventors:

Yoshihisa Dotta, Nara, JP;

Kazuo Tamaki, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor package includes: a semiconductor chip having circuits formed on a surface, and having a thickness of 0.5 μm or more and 100 μm or less; and an adhesive resin layer provided so as to cover the surface of the semiconductor chip on which the circuits are provided.


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