The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2008
Filed:
Mar. 14, 2005
Kohji Kanamori, Kawasaki, JP;
Teiichirou Nishizaka, Kawasaki, JP;
Noriaki Kodama, Kawasaki, JP;
Isao Katayama, Kawasaki, JP;
Yoshihiro Matsuura, Kawasaki, JP;
Kaoru Ishihara, Yamaguchi, JP;
Yasushi Harada, Yamaguchi, JP;
Naruaki Minenaga, Yamaguchi, JP;
Chihiro Oshita, Yamaguchi, JP;
Kohji Kanamori, Kawasaki, JP;
Teiichirou Nishizaka, Kawasaki, JP;
Noriaki Kodama, Kawasaki, JP;
Isao Katayama, Kawasaki, JP;
Yoshihiro Matsuura, Kawasaki, JP;
Kaoru Ishihara, Yamaguchi, JP;
Yasushi Harada, Yamaguchi, JP;
Naruaki Minenaga, Yamaguchi, JP;
Chihiro Oshita, Yamaguchi, JP;
NEC Electronics Corporation, Kanagawa, JP;
Abstract
According to the present invention, a gettering layer is deposited both on the side surfaces and the bottom surface of a semiconductor chip. The semiconductor chip is then mounted on the board of a package so that a Schottky barrier is formed on the bottom surface. With this structure, metal ions that pass through the board of the package can be captured by the defect layer deposited on the side surfaces and/or the bottom surface of the semiconductor chip, and by the Schottky barrier.