The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2008

Filed:

Jun. 23, 2005
Applicants:

Mikael Svard, Espoo, FI;

Nigel Martin, Salo, FI;

Inventors:

Mikael Svard, Espoo, FI;

Nigel Martin, Salo, FI;

Assignee:

Nokia Corporation, Espoo, FI;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor package includes a combination die embedded in a base. The combination die includes a plurality of functional blocks, where the functional blocks are insulated from one another on the combination die. Each functional block has plural die connectors. The base includes insulating layers conductive layers and vias. Each conductive layer has parts removed to form a pattern. The base is provided with a plurality of external connectors. A conductive path, made from a part of at least one of the conductive layers and at least one of the vias, connects one of the die connectors to a respective one of the external connectors.


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