The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2008
Filed:
Dec. 06, 2005
Koji Hattori, Tokyo, JP;
Takao Yoneyama, Anpachi-gun, JP;
Ryuichiro Abe, Ichinomiya, JP;
Minekazu Sakai, Kariya, JP;
Shigenori Yamauchi, Nisshin, JP;
Koji Hattori, Tokyo, JP;
Takao Yoneyama, Anpachi-gun, JP;
Ryuichiro Abe, Ichinomiya, JP;
Minekazu Sakai, Kariya, JP;
Shigenori Yamauchi, Nisshin, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A sensor device includes a sensor chip having a movable portion on one surface, a circuit chip laminated with the sensor chip to be opposite to the movable portion of the sensor chip, and a bump located between the sensor chip and the circuit chip. In the sensor device, the sensor chip and the circuit chip are electrically connected through the bump, and the movable portion of the sensor chip is separated from the circuit chip by a space using the bump. Accordingly, it can effectively restrict parasitic capacity of an electric connecting portion between both the chips from being changed by an impact. For example, the sensor device can be used as an angular velocity sensor device having a vibrator as the movable portion.