The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2008
Filed:
Dec. 30, 2004
Applicant:
Joon Bum Shim, Seongnam-si, KR;
Inventor:
Joon Bum Shim, Seongnam-si, KR;
Assignee:
Dongbu Electronics Co., Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract
Methods for forming a copper interconnect of a semiconductor device are disclosed. A disclosed method comprises forming a lower metal interconnect; sequentially depositing a capping layer, a first insulating layer, and a second insulating layer on the lower metal interconnect; forming a via hole by etching the first insulating layer and the second insulating layer; forming a trench and terraces by etching the second insulating layer; and exposing at least a portion of the top surface of the lower metal interconnect by etching the capping layer.