The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2008

Filed:

May. 24, 2005
Applicants:

Ling Liu, Colorado Springs, CO (US);

Albert An-bon Yeh, Colorado Springs, CO (US);

Paul Thomas Carson, Colorado Springs, CO (US);

Inventors:

Ling Liu, Colorado Springs, CO (US);

Albert An-Bon Yeh, Colorado Springs, CO (US);

Paul Thomas Carson, Colorado Springs, CO (US);

Assignee:

Agilent Technologies, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

In one embodiment, a photo-imageable material is deposited on a circuit structure. The photo-imageable material is then exposed to a pattern of radiation, thereby polymerizing portions of the photo-imageable. Un-polymerized portions of the photo-imageable material are then removed to define a solder mask having solder deposition areas. Solder is then deposited in the solder deposition areas. A circuit structure that may be produced in accordance with this method is also disclosed.


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