The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2008
Filed:
Nov. 28, 2006
Bruce Beauchamp, Gilbert, AZ (US);
Andrew Tuthill, Te Puke, NZ;
Joseph D. Fernandez, Nonthaburi, TH;
Anucha Phongsantichai, Bangkok, TH;
Bruce Beauchamp, Gilbert, AZ (US);
Andrew Tuthill, Te Puke, NZ;
Joseph D. Fernandez, Nonthaburi, TH;
Anucha Phongsantichai, Bangkok, TH;
Microchip Technology Incorporated, Chandler, AZ (US);
Abstract
An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads are connected to at least one of the inner leads, and/or at least two inner leads are connected to at least one of bond pads with a single bond wire. A single bond wire is ball or wedge bonded to a first bond pad or inner lead and subsequently wedge bonded to one or more second bond pads or inner leads, then it is connected to a third or last bond pad or inner lead. The single bond wire requires only one connection area at each of the bond pad(s) and/or inner lead(s). The bond pad(s) of the die and/or inner lead(s) of the leadframe are thereby electrically connected together by the single bond wire.