The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2008
Filed:
Sep. 26, 2003
Hiroshi Nakano, Hiratsuka, JP;
Hidetaka Ito, Hiratsuka, JP;
Hiroshi Nakano, Hiratsuka, JP;
Hidetaka Ito, Hiratsuka, JP;
Mitsubishi Engineering-Plastics Corporation, Tokyo, JP;
Abstract
A polycarbonate-based resin composition for extrusion molding using a siring die, and a molded product produced by extrusion-molding the resin composition using a sizing die, The polycarbonate-based resin composition comprises, as a main component, a polycarbonate having a viscosity-average molecular weight of 17000 to 27000 and containing main repeating units represented by the following formula (A): wherein an amount of proton (Pa) and an amount of proton (Pb) per 1 g of the polycarbonate which are calculated from respective integral values of a signal (a) detected at δ=7.96 to 8.02 ppm and a signal (b) detected at δ=8.11 to 8.17 ppm inH-NMR spectra thereof as measured in a deuterated chloroform solvent, satisfy the following formula (1):4<{(Pa)+(Pb)}<26   (1)wherein a unit of each of (Pa) and (Pb) is μmol/g. The above polycarbonate resin composition exhibits good mechanical properties and a good moldability.