The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2008

Filed:

Oct. 28, 2002
Applicants:

Tatsuo Nishimoto, Tokyo, JP;

Kiyohiro Saito, Tokyo, JP;

Kenji Tanagawa, Tokyo, JP;

Tetsuya Uchida, Tokyo, JP;

Inventors:

Tatsuo Nishimoto, Tokyo, JP;

Kiyohiro Saito, Tokyo, JP;

Kenji Tanagawa, Tokyo, JP;

Tetsuya Uchida, Tokyo, JP;

Assignee:

Hoya Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An injection compression molding method of a lens is provided, where a toggle link mechanism () is actuated to close a molding die () and a movable die plate () is moved to a position establishing a cavity thickness of greater than a thickness of an article to be molded while the die is closed. After injecting a molten resin into the cavity, the molten resin is sealed in the cavity and the toggle link mechanism () is actuated to advance the movable die plate () toward a fixed die plate (), the relative position of a rear die plate () and the movable die plate () is made constant at a position where extension of a tie bar () becomes a predetermined value, and the molten resin is cooled for a predetermined time after completion of pressurizing the resin.


Find Patent Forward Citations

Loading…