The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2008
Filed:
Mar. 07, 2005
Applicants:
Chih-min Cheng, Westford, MA (US);
Andrew Collins, Bedford, NH (US);
Inventors:
Chih-Min Cheng, Westford, MA (US);
Andrew Collins, Bedford, NH (US);
Assignee:
National Starch and Chemical Investment Holding Corporation, New Castle, DE (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/12 (2006.01); H01B 1/02 (2006.01); H01B 1/08 (2006.01);
U.S. Cl.
CPC ...
Abstract
A low stress conductive film or paste adhesive that comprises a) one or more functional acrylic copolymers or terpolymers; b) epoxy; and c) conductive filler. Additional ingredients, such as adhesion promoters and conductivity enhancers may also be utilized. The conductive film or paste adhesive provides higher adhesion strength than traditional flexible conductive film adhesives and a lower stress between the bonded components than existing high adhesion strength conductive films.