The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2008

Filed:

Apr. 10, 2002
Applicants:

Kazuhide Sato, Aichi-pref., JP;

Hidekazu Hattori, Nagoya, JP;

Toshiaki Kamiya, Yokkaichi, JP;

Osamu Inoue, Obu, JP;

Inventors:

Kazuhide Sato, Aichi-pref., JP;

Hidekazu Hattori, Nagoya, JP;

Toshiaki Kamiya, Yokkaichi, JP;

Osamu Inoue, Obu, JP;

Assignee:

Denso Corporation, Kariya, Aichi-pref., JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 29/00 (2006.01); B32B 37/00 (2006.01); H01B 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

This invention provides a method of producing a ceramic laminate body capable of suppressing the occurrence of de-lamination and cracks, and providing high reliability. This method comprises a heat-bonding step of covering a full periphery of side surfaces of ceramic layerspositioned in an orthogonal direction to a laminating direction with a side surface jig while the ceramic layers are laminated, heating the ceramic layers and pressing the ceramic layers from both end faces positioned in the laminating direction by end face jigs to form a heat-bonded ceramic laminate body; and a side surface grinding step of grinding or cutting the full periphery of the side surfaces inclusive of damage portionsoccurring in the ceramic laminate body in the heat-bonding step.


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