The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2008
Filed:
Sep. 13, 2004
Ryuji Fujii, Kwai Chung, HK;
Hiroki Matsukuma, Tokyo, JP;
Ryuji Fujii, Kwai Chung, HK;
Hiroki Matsukuma, Tokyo, JP;
SAE Magnetics (H.K.) Ltd., Kwai Chung, HK;
TDK Corporation, Tokyo, JP;
Abstract
A lapping method and apparatus is provided that increases the yield rate in the magnetic head slider manufacturing process. According to the invention, an apparatus for lapping thin film magnetic heads includes a jig block and a lapping plate. The jig block includes a first jig which holds a bar to be lapped, and second jig which holds a member for load sharing. The lapping plate is movable relative to the first jig and the second jig, and is contactable with the surface to be lapped of the bar held by the first jig and the member for load sharing held by the second jig for lapping.