The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2008
Filed:
Feb. 06, 2004
Isao Ochiai, Gunma, JP;
Kazumi Onda, Saitama, JP;
Isao Ochiai, Gunma, JP;
Kazumi Onda, Saitama, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
The preferred embodiments provide a lead frame wherein a first air ventand a second air ventare formed in an air vent forming region. When resin-molding, one end of this first air ventis disposed within the cavity, whereby air in the cavity when resin-molding can be completely released to the outside of the cavity. As a result, a package after resin-molding includes no unfilled regions or voids, whereby a semiconductor device with excellent product quality can be provided. In the background, air in cavities could not be completely released when resin-molding since, for instance, one air vent was provided at a position apart from the cavity region, and unfilled regions or voids were created.