The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2008
Filed:
Dec. 12, 2002
Tecktiong Tan, Singapore, SG;
Binghua Pan, Singapore, SG;
Jeffrey H. Burns, Kokomo, IN (US);
Arun K. Chaudhuri, Carmel, IN (US);
John R. Troxell, Sterling Heights, MI (US);
Su Liang Chan, Singapore, SG;
Tecktiong Tan, Singapore, SG;
Binghua Pan, Singapore, SG;
Jeffrey H. Burns, Kokomo, IN (US);
Arun K. Chaudhuri, Carmel, IN (US);
John R. Troxell, Sterling Heights, MI (US);
Su Liang Chan, Singapore, SG;
Delphi Technologies, Inc., Troy, MI (US);
Abstract
An optical information processing circuit assembly includes an optically transmissive substrate and a resiliently compressible circuit member affixed to the substrate and defining an opening therethrough with a number of leads disposed about the opening. An integrated imaging circuit defines a corresponding number of pads wherein the pads align with and electrically contact the leads. An optically transmissive medium may be disposed between and in contact with the substrate and the integrated imaging circuit to allow light transmission therethrough from the substrate to the imaging circuit. In one embodiment, resilient bumps are provided between the integrated imaging circuit and the resiliently compressible circuit member to form the electrical connection therebetween. Alternatively, solder bumps may replace the resilient bumps. Additional circuit components may be similarly mounted to the resiliently compressible circuit member to complete the assembly.