The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2008
Filed:
Feb. 07, 2005
Alfred J. Griffin, Jr., Dallas, TX (US);
Adel El Sayed, Dallas, TX (US);
John P. Campbell, Garland, TX (US);
Clint L. Montgomery, Coppell, TX (US);
Alfred J. Griffin, Jr., Dallas, TX (US);
Adel El Sayed, Dallas, TX (US);
John P. Campbell, Garland, TX (US);
Clint L. Montgomery, Coppell, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A multilevel metal and via structure is described. The metal conductors include a base or seed layer, a bulk conductor layer, a capping layer, and a barrier layer, and the via structure include a seed layer, a diffusion barrier layer and a metal plug. The via seed layer is controlled to a thickness that discourages the reaction between the via seed layer and the bulk conductor layer. The reaction may result in the formation of harmful voids at the bottom of the vias and is caused by having the via seed metal coming in contact with the bulk conductor through openings in the barrier layer.