The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2008
Filed:
Jun. 10, 2002
Tetsuo Uwaji, Nagoya, JP;
Kimio Akazawa, Kobe, JP;
Takashi Mizuno, Nagoya, JP;
Kenji Tsutsui, Nagoya, JP;
Kouji Kuwabara, Kobe, JP;
Tetsuo Uwaji, Nagoya, JP;
Kimio Akazawa, Kobe, JP;
Takashi Mizuno, Nagoya, JP;
Kenji Tsutsui, Nagoya, JP;
Kouji Kuwabara, Kobe, JP;
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Abstract
A method for analyzing injection molding conditions, which takes into consideration the compressibility of molten resin in a barrel and mechanical delays in resin flow caused by constituent elements of an injection molding machine and analysis results thereof are provided. In a method for analyzing injection molding conditions in which, by using input data having shape data () and injection conditions data () to perform flow analysis of the process of filling the inside of the mold with molten resin, analysis of the pressure maintenance process from the filling with molten resin to the gate sealing, and analysis of the cooling process within the mold after gate sealing, the pressure and temperature distributions of resin within the mold are calculated, data () regarding compressibility of molten resin held in the barrel of the cylinder and mechanical data caused by constituent elements of the injection molding machine are added to the input data.