The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2008
Filed:
Aug. 19, 2004
Kinuko Mishiro, Kawasaki, JP;
Kinuko Mishiro, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
To provide a component mounting substrate and a component mounting structure which absorb stresses caused by impact or by the difference in the thermal extension coefficient between substrate and component, without increasing the required accuracy in soldering the substrate and the component together. The substrate, which is to be mounted with a component having one or more solder joints via which the component is connected to the substrate, has a depressed part thereof formed on its component side, on which one or more electrodes are provided to be closely joined with the solder joints. The depressed part is filled with a filling material with rigidity different from that of a material making up the substrate body, such that the filling material is flush or almost flush with the surface of the component side of the substrate.