The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 22, 2008

Filed:

Jun. 21, 2005
Applicants:

Magall Brunet, Bellegarde, FR;

Andrew Mark Connell, Cork, IE;

Paul Mccloskey, Cork, IE;

Terence O'donnell, Cork, IE;

Stephen O'reilly, County Cork, IE;

Sean Cian O'mathuna, Limerick, IE;

Inventors:

Magall Brunet, Bellegarde, FR;

Andrew Mark Connell, Cork, IE;

Paul McCloskey, Cork, IE;

Terence O'Donnell, Cork, IE;

Stephen O'Reilly, County Cork, IE;

Sean Cian O'Mathuna, Limerick, IE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

An insulating layer () and a conductive seed layer () are applied to a substrate () in a simple process. A photo resist with palladium chloride are provided in a bath for electrophoretic deposition onto the substrate. The photo resist is an insulator and the palladium chloride is a catalyst. The layer is heated with UV to cure it. The layer is plasma etched to expose more of the palladium chloride, which acts as a catalyst for electrodes plating of the conductive seed layer. A thicker conductive layer () is then electroplated onto the seed layer. These steps may be repeated for successive insulating and/or conductive layers.


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