The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2008
Filed:
Nov. 14, 2006
Terukazu Ohtsuki, Nara, JP;
Terukazu Ohtsuki, Nara, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
Provided is an electronic circuit module using a board having no cavity and a method for efficiently fabricating it. Electronic components are mounted on the front face of a module board, and an LSI chipis die-bonded on the bottom face thereof in a bare-chip state with gold wires. Around the LSI chip, metal blocksmade of copper are mounted by soldering. The LSI chip, the gold wires, and the metal blocksprovided on the bottom face of the module boardare sealed with resinwith a motherboard-facing faceof each metal blockand a facethereof flush with the corresponding side face of the module boardexposed from the resin. These exposed portions serve as electrode terminals when the moduleis soldered to a motherboard. The module boardis obtained by cutting a sheet circuit board into individual unit module boards