The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2008

Filed:

May. 20, 2004
Applicants:

Daisuke Iitsuka, Saku, JP;

Fujimi Kimura, Tokyo, JP;

Inventors:

Daisuke IItsuka, Saku, JP;

Fujimi Kimura, Tokyo, JP;

Assignees:

TDK Corporation, Tokyo, JP;

SAE Magnetick (H.K.) Ltd., Hong Kong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/17 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided are a thin film coil formed at high densities, a method of forming a thin film coil, a thin film magnetic head which includes the thin film coil and thus enables ensuring stable recording characteristics while coping with a higher recording density, and a method of manufacturing a thin film magnetic head. The thin film coil includes a first coil having a top surface having the maximum width, an insulating wall formed by selectively etching an insulating layer filling a region between windings by using the first coil as a mask, and a second coil isolated from the first coil by the insulating wall. This easily enables forming the thin film coil in a narrower space, while ensuring electrical insulation between the windings of the first and second coils.


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