The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2008
Filed:
Feb. 21, 2006
Applicant:
Suk Kee Hong, Seoul, KR;
Inventor:
Suk Kee Hong, Seoul, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Primary Examiner:
Int. Cl.
CPC ...
G02B 26/00 (2006.01); G02B 5/18 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed herein is an optical modulator module package structure. In the optical modulator module package structure, an optical modulator device and a drive integrated circuit device are flip-chip bonded to a substrate, and an opening of the substrate is blocked using a piece of glass.
Hong, Suk. (2008). Optical modulator module package structure (U.S. Patent No. 7319553). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7319553
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