The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2008
Filed:
Jan. 27, 2006
Ryuichi Kanamura, Tokyo, JP;
Ryuichi Kanamura, Tokyo, JP;
Sony Corporation, Tokyo, JP;
Abstract
Disclosed herein is a semiconductor device having a multi-layer wiring structure includes a plurality of wiring layers laminated on a substrate, the wiring layers each including a buried wiring and a via formed by filling with a conductive material the inside of a wiring trench formed on the face side of a layer insulation film and a contact hole provided at a bottom portion of the wiring trench. The layer insulation films constituting the plurality of wiring layers are so configured that the layer insulation films are changed in the magnitude of mechanical strength alternately on a wiring layer basis in the lamination direction of the wiring layers.