The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2008
Filed:
Aug. 30, 2004
Applicants:
Jingyu Lian, Wallkill, NY (US);
Chenting Lin, Poughkeepsie, NY (US);
Nicolas Nagel, Yokohama, JP;
Michael Wise, Lagrangeville, NY (US);
Inventors:
Jingyu Lian, Wallkill, NY (US);
Chenting Lin, Poughkeepsie, NY (US);
Nicolas Nagel, Yokohama, JP;
Michael Wise, Lagrangeville, NY (US);
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 27/10 (2006.01); H01L 29/74 (2006.01);
U.S. Cl.
CPC ...
Abstract
An interconnect includes an opening formed in a dielectric layer. A conductive barrier is deposited in the opening, over which a first conductive layer is deposited. A conductive oxide is deposited over the first conductive layer, and a second conductive layer, formed from the same material as the first conductive layer, is deposited over the conductive liner.