The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2008

Filed:

Oct. 18, 2005
Applicants:

Ikuo Yoshihara, Kanagawa, JP;

Masamitsu Yamanaka, Kanagawa, JP;

Inventors:

Ikuo Yoshihara, Kanagawa, JP;

Masamitsu Yamanaka, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor image sensor module and a method for manufacturing thereof as well as a camera and a method for manufacturing thereof are provided in which a semiconductor image sensor chip and an image signal processing chip are connected with a minimum parasitic resistance and parasitic capacity and efficient heat dissipation of the image signal processing chip and shielding of light are simultaneously obtained. A semiconductor image sensor moduleat least includes a semiconductor image sensor chiphaving a transistor forming region on a first main surface of a semiconductor substrate and having a photoelectric conversion region with a light incident surface formed on a second main surface on the side opposite to the first main surface and an image signal processing chipfor processing image signals formed in the semiconductor image sensor chip, wherein a plurality of bump electrodesare formed on a first main surface, a plurality of bump electrodesare formed on the image signal processing chip, both the chipsandare formed to be laminated through heat dissipating meansand the plurality of bump electrodesof the semiconductor image sensor chipand the plurality of bump electrodeson the image signal processing chipare electrically connected.


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