The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2008
Filed:
Mar. 27, 2003
Applicants:
Kaneo Mohri, Nagoya, JP;
Masaki Mori, Nagoya, JP;
Inventors:
Kaneo Mohri, Nagoya, JP;
Masaki Mori, Nagoya, JP;
Assignee:
Japan Science and Technology Agency, Kawaguchi-shi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 7/16 (2006.01); G01L 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for producing a stress impedance effect element, the method including: connecting opposite ends of a magnetostrictive amorphous thin wire and respective electrodes by ultrasonic bonding; forming a groove in an elastic thin substrate having a thermal expansion coefficient equal to that of the magnetostrictive amorphous thin wire; installing the magnetostrictive amorphous thin wire in the groove; and bonding together the magnetostrictive amorphous thin wire and the elastic thin substrate by applying an insulating adhesive across the magnetoresistive amorphous thin wire.