The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2008
Filed:
Apr. 24, 2002
Giacomo Stefano Roba, Monza, IT;
Lidia Terruzzi, Triuggio, IT;
Sabrina Fogliani, Segrate, IT;
Marco Armondi, Pavia, IT;
Sandra Joanna Nagelvoort, Wn Vlaardingen, NL;
Johannes Adrianus Van Eekelen, Pe Rozenburg, NL;
Adrianus Gijsbertus Maria Abel, Ka Capelle A/D Ijssel, NL;
Gouke Dirk Jan Geus, Tg Vlaardingen, NL;
Duurt Pieter Willem Alkema, Cb Den Haag, NL;
Giacomo Stefano Roba, Monza, IT;
Lidia Terruzzi, Triuggio, IT;
Sabrina Fogliani, Segrate, IT;
Marco Armondi, Pavia, IT;
Sandra Joanna Nagelvoort, Wn Vlaardingen, NL;
Johannes Adrianus Van Eekelen, Pe Rozenburg, NL;
Adrianus Gijsbertus Maria Abel, Ka Capelle A/D Ijssel, NL;
Gouke Dirk Jan Geus, Tg Vlaardingen, NL;
Duurt Pieter Willem Alkema, Cb Den Haag, NL;
Prysmian Cavi E Sistemi Energia S.R.L., Milan, IT;
Abstract
An optical fiber having an internal glass portion, a first coating layer surrounding the glass portion and a second coating layer surrounding the first coating layer. The first coating layer is formed from a cured polymeric material obtained by curing a radiation curable composition having a radiation curable oligomer having a backbone derived from polypropylene glycol and a dimer acid based polyester polyol. The cured polymeric material has: (a) a hardening temperature (Th) from −10° C. to about −20° C. and a modulus measured at the Th lower than 5.0 MPa; or (b) a hardening temperature (Th) from −20° C. to about −30° C. and a modulus measured at the Th lower than 20.0 MPa; or (c) a hardening temperature (Th) lower than about −30° C. and a modulus measured at the Th lower than 70.0 MPa.