The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2008
Filed:
Sep. 26, 2005
Applicants:
Noboru Uehara, Okaya, JP;
Tsuyoshi Shintate, Matsuyama, JP;
Kazuaki Sakurada, Suwa, JP;
Inventors:
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wiring pattern formation method in which a wiring pattern is formed by arranging, in a region which is demarcated by a partition wall, liquid material which includes an electrically conductive material, including: arranging a resin material around the periphery of a region upon which the wiring pattern is to be formed; imparting liquid affinity to a demarcated region which has been demarcated by the resin material; narrowing down the demarcated region by flowing out the resin material towards and into the demarcated region; and forming the partition wall by curing the resin material.