The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2008

Filed:

Oct. 19, 2004
Applicants:

Sang-jeong OH, Seoul, KR;

Yeong-kwan Kim, Kyungki-do, KR;

Seung-hwan Lee, Seoul, KR;

Dong-chan Kim, Seoul, KR;

Young-wook Park, Kyungki-do, KR;

Inventors:

Sang-jeong Oh, Seoul, KR;

Yeong-kwan Kim, Kyungki-do, KR;

Seung-hwan Lee, Seoul, KR;

Dong-chan Kim, Seoul, KR;

Young-wook Park, Kyungki-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8242 (2006.01); H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides integrated circuit devices that include a semiconductor substrate having a semiconductor region of first conductivity type therein extending adjacent the surface of the substrate. The device further includes an electrically insulating layer with a contact hole in it that exposes the semiconductor region of first conductivity type on the surface of the semiconductor substrate. The device still further includes a poly-SiGeconductive plug of first conductivity type that extends in the contact hole and is electrically connected to the semiconductor region of first conductivity type is provided. Related methods of fabricating integrated circuit devices are also provided.


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