The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2008
Filed:
Aug. 11, 2005
Chee Hong Choi, Seoul, KR;
Chee Hong Choi, Seoul, KR;
Dongbu Electronics Co., Ltd., Seoul, KR;
Abstract
A copper line on a semiconductor device and a method for forming the same is disclosed, wherein an insulating layer is deposited so as to minimize the dishing of IMD without using a dummy area when performing the planarization process. The method of forming the copper line on the semiconductor device includes the steps of forming an IMD on a semiconductor substrate including a lower metal layer, forming an isolation layer on the IMD, exposing the lower metal layer by patterning the IMD and the isolation layer, forming a copper layer on the exposed lower metal layer and the isolation layer, and planarizing the copper layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile