The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2008

Filed:

May. 27, 2005
Applicants:

Tsuyoshi Furuse, Kanagawa-ken, JP;

Shosei Mori, Kanagawa-ken, JP;

Masahiro Terada, Kanagawa-ken, JP;

Inventors:

Tsuyoshi Furuse, Kanagawa-ken, JP;

Shosei Mori, Kanagawa-ken, JP;

Masahiro Terada, Kanagawa-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

In regard to an electroconductive pattern including a high resistivity region partially, by forming a pattern with a photosensitive resin, making the pattern absorb liquid containing a metal component, and baking this, an electroconductive film of metal oxide is formed, this electroconductive film is further covered by a gas shielding layer, and portions which are not shielded are reduced selectively to be made low resistance metal film regions. Since the material which constitutes the electroconductive pattern is hardly removed, a load concerning material reuse is mitigated and material cost is reduced.


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