The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2008

Filed:

Jul. 28, 2003
Applicants:

Yukio Kakita, Ritto, JP;

Yukio Nakagawa, Ritto, JP;

Akira Asahina, Kyoto, JP;

Inventors:

Yukio Kakita, Ritto, JP;

Yukio Nakagawa, Ritto, JP;

Akira Asahina, Kyoto, JP;

Assignee:

Ishida Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65B 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a packaging apparatus () capable of adjusting the thickness of a package with a simple configuration. The packaging apparatus () is a packaging apparatus that manufactures a package (B) wherein articles to be packaged, such as foodstuffs, and gas are sealed in a bag, and comprises a cooling unit (). The cooling unit () cools the gas sent to a tubular film (F) formed in a bag shape. The packaging apparatus () manufactures the package (B) wherein the gas, having a temperature lower than the outside air, and the articles to be packaged are sealed.


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