The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2007
Filed:
Oct. 06, 2005
Morihisa Hirata, Kanagawa, JP;
Morihisa Hirata, Kanagawa, JP;
NEC Electronics Corporation, Kawasaki, Kanagawa, JP;
Abstract
A system-in-package type semiconductor device includes a plurality of semiconductor chips, a first semiconductor chipto which electric power is supplied from first power supply wiring, and first ground wiringto which the first circuit unit is coupled. Moreover, the system-in-package type semiconductor device includes a second semiconductor chipto which electric power is supplied from second power supply wiring, and second ground wiringcoupled to the second circuit unit. The first semiconductor chip includes a first interface circuit unit, and the second circuit unit includes a second interface circuit unitconfigured to perform inputting or outputting of a signal to and from the first interface circuit unit. The first ground wiringis coupled to the second ground wiringthrough a protection circuit, and the second interface circuit unit is placed in the vicinity of the first interface circuit unit.