The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2007
Filed:
Feb. 21, 2003
Shoji Ito, Sakura, JP;
Osamu Nakao, Sakura, JP;
Reiji Higuchi, Sakura, JP;
Masahiro Okamoto, Sakura, JP;
Shoji Ito, Sakura, JP;
Osamu Nakao, Sakura, JP;
Reiji Higuchi, Sakura, JP;
Masahiro Okamoto, Sakura, JP;
Fujikura Ltd., Tokyo, JP;
Abstract
A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer); a conductive layerformed on one surface of said insulating substrate componentin the form of an electrode pattern; an adhesive layerformed on the other surface of said insulating substrate component; and a conductive resin compositionwith which is filled a through hole passing through said insulating substrate component, said adhesive layer and said conductive layer in order to make interlayer interconnection. The bore diameter of the conductive layer portionof the through holeis smaller than the bore diameter of the insulating resin layer portion and the adhesive layer portionto establish electrical connection between the conductive resin compositionand the conductive layerby the rare surfaceof the conductive layer