The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2007
Filed:
Dec. 19, 2003
Wenjun Zhang, Suzhou, CN;
Wenjun Zhang, Suzhou, CN;
Heraeus Inc., Chandler, AZ (US);
Abstract
A method of fabricating a sputter target comprises: homogenously blending a plurality of powders including at least a first powder and a second powder. The first powder is comprised of chromium (Cr), cobalt (Co), ruthenium (Ru), nickel (Ni), or iron (Fe). The second powder is comprised of boron (B), carbon (C), a nitrogen (N)-containing material, a boride, a carbide, a nitride, a silicide, an oxygen (O)-containing material or an oxide. The second powder has a particle size of between 0.01 microns and 50 microns. The method further comprises: canning the blended plurality of powders to form a substantially non-segregated encapsulated powdered material mix; pressing the encapsulated powdered material mix to form a billet; and machining the billet to form a sputter target.