The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2007

Filed:

Apr. 30, 2004
Applicants:

Kinya Nippa, Sunnyvale, CA (US);

Wei Hong Soh, Singapore, SG;

Inventors:

Kinya Nippa, Sunnyvale, CA (US);

Wei Hong Soh, Singapore, SG;

Assignee:

Finisar Corporation, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

Exemplary methods for making a solder joint between two articles are disclosed. The method includes the steps of positioning a first article and a second article to be soldered together. At least one of the first article and the second article has at least one button attached to it. The button has a desired height above a surface of the article to which it is attached. The second article has a quantity of solder located in a position where the solder joint is to be formed. A heat source is applied until the quantity of solder liquefies. The heat source is removed until the solder solidifies with a uniform thickness approximately equal to the height of the button.


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