The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2007
Filed:
Sep. 15, 2005
Akira Nakashima, Imari, JP;
Akira Nakashima, Imari, JP;
Sumco Corporation, Tokyo, JP;
Abstract
This invention relates to an end supporting plate which can be attached to both ends of cylindrical ingot. By wire saw cutting, semiconductor wafers are sliced from the ingot attached with the end supporting plates. The end supporting plate has an elongated support surface. Maximum width of the support surface along a direction perpendicular to an axial direction of the plate is smaller than the length along the axial direction. The length of the support surface is approximately similar to a diameter of the ingot to which the end support plate is to be attached, whereas maximum width of the support is smaller than the diameter of the ingot.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile