The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2007
Filed:
Dec. 19, 2003
Toshihiko Fujii, Kobe, JP;
Takashi Ohta, Kobe, JP;
Shinichi Sugiura, Kobe, JP;
Toshimasa Akamatsu, Ritto, JP;
Katsufumi Morimune, Kobe, JP;
Toshihiko Fujii, Kobe, JP;
Takashi Ohta, Kobe, JP;
Shinichi Sugiura, Kobe, JP;
Toshimasa Akamatsu, Ritto, JP;
Katsufumi Morimune, Kobe, JP;
Fujitsu Ten Limited, Kobe, JP;
Abstract
A die bonding apparatus for die bonding at least two members, which are heated in a heat treatment furnace, comprising a first member having a surface to be die bonded on which solder is disposed and a second member disposed to face the first member in a state in which the solder disposed on the surface of the first member to be die bonded is interposed therebetween, and a base portion for mounting the first member thereon in a predetermined position, wherein the base portion has a temperature distribution so that a temperature of a vicinity of a central portion in a predetermined direction of the base portion is higher than that of a vicinity of an end portion of the base portion in a state in which heating is effected in the heat treatment furnace to, so that it is possible to suppress the occurrence of bubbles in the solder.