Multi-network modules with hot-swap capability

Abstract

A payload module () includes a payload subunit () coupled to the payload module, where the payload module has one of a 3U form factor, a 6U form factor and a 9U form factor. At least one multi-gigabit connector () is coupled to a rear edge () of the payload module and to the payload subunit, where the at least one multi-gigabit connector is coupled to communicatively interface the payload subunit to a backplane (), where the backplane includes a switched fabric () coincident with at least one of a VMEbus network and a PCI network, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload subunit through the at least one multi-gigabit connector. A payload module power connector () includes a plurality of pins (), where at least one of the plurality of pins has a length different from a remaining portion of the plurality of pins such that power between a main power bus () on the backplane and a payload module power bus () on the payload module is at least one of applied and removed, in a smooth and gradually ramped fashion over a time period (), where power and any concurrent data operations on the backplane remain uninterrupted and unaffected during the at least one of applying and removing power between the main power bus and the payload module power bus.