The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2007
Filed:
Oct. 22, 2004
Takafumi Kawasaki, Tokyo, JP;
Hirozoh Tsuruta, Tokyo, JP;
Hirokazu Nishida, Tokyo, JP;
Seiichi Mimura, Tokyo, JP;
Masayuki Hamayasu, Tokyo, JP;
Hisashi Tominaga, Tokyo, JP;
Takafumi Kawasaki, Tokyo, JP;
Hirozoh Tsuruta, Tokyo, JP;
Hirokazu Nishida, Tokyo, JP;
Seiichi Mimura, Tokyo, JP;
Masayuki Hamayasu, Tokyo, JP;
Hisashi Tominaga, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Chiyoda-Ku, Tokyo, JP;
Abstract
A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid to a cutting interface between the workpiece and a wire, and includes: a storage tank with a heating mechanism for storing and heating the slurry; a thermal insulating pipe for transporting the slurry sent with a pump from the storage tank with a heating mechanism to a position before a position where the wire is incorporated into the workpiece, while keeping the slurry at a predetermined temperature; a thermostat for keeping a temperature in a vicinity of the workpiece fixed to a stage at the predetermined temperature; and a wire heating mechanism for heating the wire to the predetermined temperature. Consequently, the cutting resistance decreases during cutting machining of a silicon ingot, and the variation in the cutting resistance also decreases, whereby a high-quality wafer can be obtained at a high efficiency and a low cost.