The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2007
Filed:
Mar. 29, 2007
J. Scott Rodgers, San Diego, CA (US);
Joanna N. Ptasinski, San Diego, CA (US);
Stephen D. Russell, San Diego, CA (US);
Michael G. Lovern, Spring Valley, CA (US);
Randy L. Shimabukuro, Kapolei, HI (US);
J. Scott Rodgers, San Diego, CA (US);
Joanna N. Ptasinski, San Diego, CA (US);
Stephen D. Russell, San Diego, CA (US);
Michael G. Lovern, Spring Valley, CA (US);
Randy L. Shimabukuro, Kapolei, HI (US);
The United States of America as represented by the Secretary of the Navy, Washington, DC (US);
Abstract
A Electronic/Photonic Bandgap Device (NC#98614). The apparatus includes a substrate; an electronics layer operatively coupled to the substrate; and an optical bus layer operatively coupled to the electronics layer. The optical bus layer comprises at least one 3D photonic bandgap structure having at least one period operatively coupled to the electronics layer and comprising a plurality of honeycomb-like structures having a plurality of high index regions and a plurality of low index regions, wherein the plurality of honeycomb-like structures comprises at least four honeycomb-like structures layered over each other, wherein a second honeycomb-like structure is offset from a first honeycomb-like structure, wherein a third honeycomb-like structure is offset from a second honeycomb-like structure, and wherein a fourth honeycomb-like structure is not offset from the first honeycomb-like structure. The 3D photonic bandgap structure and the electronics layer are monolithically integrated over the substrate.