The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2007

Filed:

Nov. 05, 2004
Applicants:

Andrew J. Ouderkirk, Woodbury, MN (US);

Denny G. Aeschliman, Austin, TX (US);

Hung T. Tran, Woodbury, MN (US);

Kenneth A. Epstein, St. Paul, MN (US);

Michael A. Meis, Stillwater, MN (US);

John C. Schultz, Afton, MN (US);

Inventors:

Andrew J. Ouderkirk, Woodbury, MN (US);

Denny G. Aeschliman, Austin, TX (US);

Hung T. Tran, Woodbury, MN (US);

Kenneth A. Epstein, St. Paul, MN (US);

Michael A. Meis, Stillwater, MN (US);

John C. Schultz, Afton, MN (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2006.01); F21V 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An illumination assembly includes a heat dissipating member having a plurality of circuitized strips disposed thereon a spaced relationship. Each circuitized strip includes an electrically insulative substrate having at least one circuit trace on a first side of the substrate and an electrically and thermally conductive layer on a second side of the substrate, such that the at least one circuit trace is electrically insulated from the second side of the substrate. The circuitized strips have a plurality of vias extending from the first side to the second side of the substrate. A plurality of LEDs are disposed in the plurality of vias, such that each LEDs is disposed on the electrically and thermally conductive layer on the second side of the substrate and electrically connected to the at least one circuit trace on the first side of the substrate.


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