The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2007

Filed:

Aug. 31, 2004
Applicants:

Charles Leu, Fremont, CA (US);

Tai-cherng Yu, Tu-Cheng, CA (US);

Ga-lane Chen, Fremont, CA (US);

Inventors:

Charles Leu, Fremont, CA (US);

Tai-Cherng Yu, Tu-Cheng, CA (US);

Ga-Lane Chen, Fremont, CA (US);

Assignee:

Hon Hai Precision Industry Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/00 (2006.01); C09K 5/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat pipe () includes a pipe (), a wick (), and an operating fluid. The wick is fixedly engaged with an inside wall of the pipe. The operating fluid is sealed in the pipe and soaks the wick. The operating fluid includes a pure liquid, and a plurality of carbon nanocapsules () suspended in the pure liquid. The pure liquid can be selected from the group consisting of pure water, ammonia, methanol, acetone and heptane. Each carbon nanocapsule is a polyhedral carbon cluster (), with a metal () having high thermal conductivity filled therein. The operating fluid has high thermal conductivity and uniform operation, and is recyclable with no pollution of the environment. The heat pipe has correspondingly high thermal conductivity.


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