The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2007
Filed:
Jan. 28, 2003
Tsuyoshi Mita, Kawasaki, JP;
Masaharu Hida, Kawasaki, JP;
Kazuaki Kurihara, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
When wire-bonding process is effected, a head assembly is held between a pair of clamp members. A head slider is urged against a microactuator. The urging force is transmitted to the microactuator through second adhesive layers. Since the second adhesive layers are positioned symmetrically around the rotational axis of the head slider, the urging force tends to act along the rotational axis. The microactuator is simultaneously urged against the support member. The urging force is transmitted from a first adhesive layer to the support member. Since the first adhesive layer extends around the rotational axis, the urging force tends to act along the rotational axis. The head slider is thus allowed to keep a uniform attitude. The microactuator is also allowed to keep a uniform attitude. The microactuator is prevented from suffering from substantial bending stresses.