The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2007
Filed:
Jun. 30, 2005
Hae-hyung Lee, Suwon-si, KR;
Sang-wook Park, Seongnam-si, KR;
Joong-hyun Baek, Suwon-si, KR;
Dong-ho Lee, Seongnam-si, KR;
Jin-yang Lee, Suwon-si, KR;
Hae-Hyung Lee, Suwon-si, KR;
Sang-Wook Park, Seongnam-si, KR;
Joong-Hyun Baek, Suwon-si, KR;
Dong-Ho Lee, Seongnam-si, KR;
Jin-Yang Lee, Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
The semiconductor chip package may include a substrate having circuit patterns and substrate pads connected with the circuit patterns. At least one semiconductor chip is mounted on the substrate, and a thermoelectric cooler having a P-type material plate and an N-type material plate is mounted on the semiconductor chip. Portions of the P-type and N-type material plates may be attached on the semiconductor chip. The P-type and N-type material plates may be electrically connected to the circuit patterns of the substrate to be provided with DC power.