The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2007
Filed:
Jan. 27, 2005
Charles Leu, Fremont, CA (US);
Tai-cherng Yu, Tu-Cheng, TW;
Chuan-de Huang, Tu-Cheng, TW;
Wen-jeng Huang, Tu-Cheng, TW;
Jhy-chain Lin, Tu-Cheng, TW;
Ga-lane Chen, Fremont, CA (US);
Charles Leu, Fremont, CA (US);
Tai-Cherng Yu, Tu-Cheng, TW;
Chuan-De Huang, Tu-Cheng, TW;
Wen-Jeng Huang, Tu-Cheng, TW;
Jhy-Chain Lin, Tu-Cheng, TW;
Ga-Lane Chen, Fremont, CA (US);
Hon Hai Precision Industry Co., Ltd., Tu-Cheng, Taipei Hsien, TW;
Abstract
An integrated circuit package includes a die mounted on a substrate, an integrated heat spreader set above the die, and an array of carbon nanotubes mounted between the die and the integrated heat spreader. The integrated heat spreader is fixed on the substrate, and includes an inner face. The array of carbon nanotubes is formed on the inner face of the integrated heat spreader. Top and bottom ends of the carbon nanotubes perpendicularly contact the integrated heat spreader and the die respectively. Each carbon nanotube can be capsulated in a nanometer-scale metal having a high heat conduction coefficient.